Micro-Glass:
Electronic-Grade Glass
Empowering Advanced Packaging: The Key Material Choice for Ultimate Performance
In advanced semiconductor manufacturing, escalating chip performance and integration density are pushing conventional substrate materials beyond their physical limits. Engineered specifically for packaging applications in high-frequency, high-density, and extreme environments, New Ray Innovation’s Micro-Glass (electronic-grade glass) delivers optimal structural stability and signal transmission performance.
Core Technological Advantages
Superior Thermal Stability
Featuring an ultra-low Coefficient of Thermal Expansion (CTE), it effectively prevents packaging deformation during temperature fluctuations under heavy processor loads, ensuring high yield rates and process consistency.
Exceptional Signal Integrity
With optimized dielectric constant and low dielectric loss characteristics, it minimizes latency and interference during high-frequency signal transmission, making it the ideal substrate for AI and High-Performance Computing (HPC) chips.
High-Precision Surface Finishing
Driven by New Ray Innovation’s proprietary processing technology, it offers mirror-grade planarity to ensure sub-nanometer accuracy in subsequent circuit patterning and interconnection, significantly boosting final component reliability.
Application Areas
The Micro-Glass electronic-grade glass is widely utilized in advanced MEMS probe card modules, high-speed data transmission modules, and multi-chip stacked packaging. Beyond material supply, New Ray Innovation leverages over a decade of testing expertise to provide comprehensive end-to-end technical services—from co-design to verification—ensuring your products stay ahead in the market.